参数名称 | 参数值 |
---|---|
Source Content uid | QS3VH861QG8 |
Brand Name | Renesas |
是否无铅 | 不含铅 |
生命周期 | Active |
Objectid | 4035307077 |
零件包装代码 | QSOP |
包装说明 | SSOP, SSOP24,.24 |
针数 | 24 |
制造商包装代码 | PCG24 |
Reach Compliance Code | compliant |
HTS代码 | 8542.39.00.01 |
Factory Lead Time | 26 weeks 1 day |
风险等级 | 6.58 |
Samacsys Description | The QS3VH861 HotSwitch with 10-bit flow-through pin out is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH861 ideal for high performance communications applications. The QS3VH861 operates from -40C to +85C. |
Samacsys Manufacturer | Renesas Electronics |
Samacsys Modified On | 2023-10-24 19:30:29 |
YTEOL | 6.25 |
系列 | CB3Q/3VH/3C/2B |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e3 |
长度 | 8.7 mm |
逻辑集成电路类型 | BUS DRIVER |
湿度敏感等级 | 1 |
位数 | 10 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP24,.24 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
包装方法 | TR |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 0.2 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.72 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |