参数名称 | 参数值 |
---|---|
Source Content uid | NLVVHC1GU04DFT2G |
Brand Name | onsemi |
是否无铅 | ![]() |
是否Rohs认证 | ![]() |
生命周期 | Obsolete |
Objectid | 8150261344 |
零件包装代码 | SC-88A (SC-70-5 / SOT-353) |
包装说明 | HALOGEN FREE AND ROHS COMPLIANT, SC-70, SC-88A, SOT-353, 5 PIN |
针数 | 5 |
制造商包装代码 | 419A-02 |
Reach Compliance Code | compliant |
HTS代码 | 8542.39.00.01 |
Factory Lead Time | 2 days |
风险等级 | 9.06 |
Samacsys Description | Designed for 2.0 V to 5.5 V VCC Operation; High Speed: tPD = 2.5ns (Typ) at VCC = 5V; Low Power Dissipation: ICC = 1µA (Max) at TA = 25°C; Power Down Protection Provided on Inputs; Balanced Propagation Delays; Pin and Function Compatible with Other Standard Logic Families; Chip Complexity: FETs = 105; Pb-Free Packages are Available |
Samacsys Manufacturer | onsemi |
Samacsys Modified On | 2025-01-22 16:53:39 |
系列 | AHC/VHC/H/U/V |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e3 |
长度 | 2 mm |
逻辑集成电路类型 | BUFFER |
湿度敏感等级 | 1 |
功能数量 | 1 |
输入次数 | 1 |
端子数量 | 5 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 15.5 ns |
筛选级别 | AEC-Q100 |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 1.25 mm |