参数名称 | 参数值 |
---|---|
Source Content uid | 74LV1GW98ACME-E |
Brand Name | Renesas |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
生命周期 | Obsolete |
Objectid | 113231093 |
零件包装代码 | CMPAK |
包装说明 | TSSOP, TSSOP6,.08 |
针数 | 6 |
制造商包装代码 | PTSP0006JA |
Reach Compliance Code | compliant |
HTS代码 | 8542.39.00.01 |
风险等级 | 9.58 |
Samacsys Description | Support is limited to customers who have already adopted these products.These logic ICs with ultra-small package with 1-3 gate are ideal for reducing device size and allowing effective use of board space. |
Samacsys Manufacturer | Renesas Electronics |
Samacsys Modified On | 2023-10-24 19:30:29 |
YTEOL | 0 |
JESD-30 代码 | R-PDSO-G6 |
负载电容(CL) | 50 pF |
最大I(ol) | 0.006 A |
端子数量 | 6 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP6,.08 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TR |
Prop。Delay @ Nom-Sup | 16.5 ns |
认证状态 | Not Qualified |
施密特触发器 | YES |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |