Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 其他特性 | 晶体频率 | 破损率 | 负电源额定电压 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | HTS代码 | YTEOL | Source Content uid | 零件包装代码 | 针数 | 交付时间 | Country Of Origin | |
对比 | LUCL7590BAE | Broadcom Limited | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1807 | 2022-06-03 17:55:09 | PLASTIC, SOG-16 | compliant | 8542.39.00.01 | 2 | ||||||||||||||||||
对比 | ATTL7590AAE | Avago Technologies | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1778 | 2022-06-02 12:37:02 | SOP, | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | ATTL7590AAE-TR | Avago Technologies | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1778 | 2022-06-02 12:37:02 | SOP, | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | LUCL7590BAE-TR | Avago Technologies | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1778 | 2022-06-02 12:37:02 | SOP, | unknown | 8542.39.00.01 | |||||||||||||||||||
对比 | LUCL7590BAE | Avago Technologies | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1778 | 2022-06-03 17:55:09 | SOP, | unknown | 8542.39.00.01 | 2 | ||||||||||||||||||
对比 | ATTL7590AAE | Broadcom Limited | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1807 | 2022-06-02 12:37:02 | SOP, | compliant | 8542.39.00.01 | |||||||||||||||||||
对比 | ATTL7590AAE-TR | Broadcom Limited | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1807 | 2022-06-02 12:37:02 | SOP, | compliant | 8542.39.00.01 | |||||||||||||||||||
对比 | LUCL7590BAE-TR | Broadcom Limited | 查询价格 | Active | 5 V | -170 V | 1 | INDUSTRIAL | TELEPHONE RINGER CIRCUIT | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -40 °C | 240 | 30 | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.67 mm | 1807 | 2022-06-02 12:37:02 | SOP, | compliant | 8542.39.00.01 | |||||||||||||||||||
对比 | TEA1062AT/C4,118 | NXP Semiconductors | 查询价格 | Yes | Yes | Active | 2.7 V | BIPOLAR | 1 | 1.35 µA | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | 2245 | 2023-08-02 00:33:27 | PLASTIC, SO-16 | compliant | 8542.39.00.01 | TEA1062AT/C4,118 | SOIC | 16 | ||||||||||
对比 | MT88E39ASR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 3 V | CMOS | IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE | 1 | INDUSTRIAL | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | R-PDSO-G16 | e3 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2188 | 2024-11-16 00:00:48 | 0.300 INCH, LEAD FREE, MS-013AA, SOIC-16 | compliant | 24.48 | 8 weeks | ||||||||||||||||
对比 | MT88E39AS1 | Microchip Technology Inc | 查询价格 | Yes | Active | 3 V | CMOS | IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE | 1 | INDUSTRIAL | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | R-PDSO-G16 | e3 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 10.3 mm | 2.65 mm | 2188 | 2024-11-16 00:00:48 | 0.300 INCH, LEAD FREE, MS-013AA, SOIC-16 | compliant | 24.48 | 8 weeks | ||||||||||||||||
对比 | TEA1062AT/C4,112 | NXP Semiconductors | 查询价格 | Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDSO-G16 | e4 | Not Qualified | 1 | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | 2245 | 2024-05-23 06:11:42 | SOP, | compliant | 8542.39.00.01 | TEA1062AT/C4,112 | SOIC | 16 | ||||||||||||
对比 | BA6566FP-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | BIPOLAR | 1 | 125 µA | OTHER | TELEPHONE SPEECH CIRCUIT | R-PDSO-G26 | e3/e2 | Not Qualified | 60 °C | -35 °C | 260 | 10 | 26 | PLASTIC/EPOXY | HSSOP | SOP32,.3,32 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | 2024-06-03 16:52:42 | HSOP-24 | compliant | 8542.39.00.01 | SOIC | 24 | ||||||||||||
对比 | BA8206F-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 24 V | BIPOLAR | 1 | 1.7 µA | COMMERCIAL EXTENDED | TELEPHONE RINGER CIRCUIT | R-PDSO-G8 | e3/e2 | Not Qualified | 75 °C | -25 °C | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | 2024-06-03 17:24:36 | SOP-8 | compliant | 8542.39.00.01 | 2 | SOIC | 8 | Philippines | |||||||||
对比 | TEA1062A/C4/M1,112 | NXP Semiconductors | 查询价格 | Yes | Yes | Active | 2.7 V | 1 | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDIP-T16 | e4 | Not Qualified | 75 °C | -25 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 38.1 mm | 4.32 mm | 2245 | 2024-05-23 08:36:51 | DIP, | compliant | 8542.39.00.01 | TEA1062A/C4/M1,112 | DIP | 16 | |||||||||||||
对比 | BA6566F-T1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | 2022-06-02 12:36:34 | SOP-18 | compliant | 8542.39.00.01 | SOIC | 18 | ||||||||||||||||||
对比 | BU8307CF-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | CMOS | SELECTABLE MAKE/BREAK RATIO 1:2 | 3.58 MHz | 1:1.5 | 1 | 1 µA | COMMERCIAL | TELEPHONE DIALER CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 60 °C | -10 °C | 260 | 10 | 24 | PLASTIC/EPOXY | SOP | SOP24,.3 | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 15 mm | 1.9 mm | 2363 | 2023-08-02 00:37:13 | SOP-24 | compliant | 8542.39.00.01 | 2 | SOIC | 24 | |||||||
对比 | BA6566FP-T1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 1 | TELEPHONE SPEECH CIRCUIT | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | HSSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 13.6 mm | 2.11 mm | 2363 | 2022-06-02 12:36:17 | HSOP-24 | compliant | 8542.39.00.01 | SOIC | 24 | ||||||||||||||||||
对比 | BA6566F-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | BIPOLAR | 1 | 125 µA | OTHER | TELEPHONE SPEECH CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 60 °C | -35 °C | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | SOP18,.3 | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | 2024-06-03 15:57:58 | SOP-18 | compliant | 8542.39.00.01 | SOIC | 18 | ||||||||||||
对比 | TEA1062A | NXP Semiconductors | 查询价格 | Yes | Yes | Active | 3.4 V | BIPOLAR | 1 | 1.35 mA | COMMERCIAL EXTENDED | TELEPHONE SPEECH CIRCUIT | R-PDIP-T16 | Not Qualified | 75 °C | -25 °C | 245 | 40 | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 21.6 mm | 4.7 mm | 2245 | 2023-08-01 22:17:38 | 0.300 INCH, PLASTIC, SOT-38, DIP-16 | compliant | 8542.39.00.01 | 2 | TEA1062A | DIP | 16 |