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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | YTEOL | Country Of Origin | 交付时间 | |
对比 | LM567CMX/NOPB | Texas Instruments | 查询价格 | Yes | Yes | Active | 5 V | 1 | 15 mA | COMMERCIAL | TONE DECODER CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | LM567CMX/NOPB | 2477 | 2024-11-17 00:01:13 | SOIC | SOP-8 | 8 | compliant | EAR99 | 8542.39.00.01 | 15 | ||||||
对比 | LMC567CMX/NOPB | Texas Instruments | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | 1.3 mA | OTHER | TONE DECODER CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 100 °C | -25 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | LMC567CMX/NOPB | 2477 | 2024-11-17 00:01:13 | SOIC | SOP, SOP8,.23 | 8 | compliant | 8542.39.00.01 | 15 | |||||
对比 | LM567CN/NOPB | Texas Instruments | 查询价格 | Yes | Yes | Active | 5 V | 1 | 15 mA | COMMERCIAL | TONE DECODER CIRCUIT | R-PDIP-T8 | e4 | Not Qualified | 1 | 70 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.817 mm | 5.08 mm | LM567CN/NOPB | 2477 | 2024-11-17 00:01:13 | DIP | DIP-8 | 8 | compliant | EAR99 | 8542.39.00.01 | 15 | Malaysia | |||||||
对比 | MT8888CS1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 2024-11-15 23:14:23 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 19.95 | 8 weeks | ||||||||||||
对比 | LM567CM/NOPB | Texas Instruments | 查询价格 | Yes | Yes | Active | 5 V | 1 | 15 mA | COMMERCIAL | TONE DECODER CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | LM567CM/NOPB | 2477 | 2024-11-17 00:01:13 | SOIC | SOP-8 | 8 | compliant | EAR99 | 8542.39.00.01 | 15 | ||||||
对比 | MT8870DSR1 | Microsemi Corporation | 查询价格 | Yes | Yes | Transferred | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2192 | 2024-06-03 15:51:32 | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | ||||||||||
对比 | MT88L70AS1 | Microsemi Corporation | 查询价格 | Yes | Yes | Transferred | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2192 | 2024-06-03 17:48:15 | SOIC | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | 18 | compliant | 8542.39.00.01 | ||||||||||
对比 | HT9170D | Holtek Semiconductor Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 7 mA | COMMERCIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | Not Qualified | 70 °C | -20 °C | 18 | PLASTIC/EPOXY | SOP | SO18(UNSPEC) | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | 2037 | 2024-03-02 22:07:06 | compliant | 8542.39.00.01 | ||||||||||||||||||||
对比 | MT8870DSR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 7.5 mm | 11.55 mm | 2.65 mm | 2188 | 2024-11-15 23:14:23 | 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 | compliant | 19.95 | 4 weeks | |||||||||||
对比 | MT8870DNR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2188 | 2024-11-16 00:00:48 | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 19.95 | 4 weeks | ||||||||||||
对比 | BU8872FS-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | 4.4 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 85 °C | -40 °C | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | SOP16,.25,32 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | 2024-06-03 18:00:10 | SOIC | SSOP-16 | 16 | compliant | 8542.39.00.01 | 2 | Philippines | ||||||
对比 | MT8870DS1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 9 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.4 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2188 | 2024-11-15 23:14:23 | compliant | 19.95 | 4 weeks | |||||||||||||||
对比 | MT8880CSR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 2024-11-16 00:00:48 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 19.95 | 8 weeks | ||||||||||||
对比 | MT8880CS1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 2024-11-16 00:00:48 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 19.95 | 8 weeks | ||||||||||||
对比 | MT8889CS1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 11 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 7.5 mm | 12.8 mm | 2.65 mm | 2188 | 2024-11-15 23:14:23 | 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 | compliant | 19.95 | 8 weeks | ||||||||||||
对比 | MT88L70ANR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 3 V | CMOS | 1 | 5.5 mA | INDUSTRIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G20 | e3 | Not Qualified | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | 2188 | 2024-11-16 00:00:48 | 5.30 MM, LEAD FREE, MO-150AE, SSOP-20 | compliant | 19.95 | 8 weeks | ||||||||||||
对比 | BA1604F-T1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 6 V | 1 | TONE DECODER CIRCUIT | R-PDSO-G8 | e3/e2 | Not Qualified | 260 | 10 | 8 | PLASTIC/EPOXY | LSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 4.4 mm | 5 mm | 1.6 mm | 2363 | 2024-03-02 22:32:51 | SOIC | SOP-8 | 8 | compliant | 8542.39.00.01 | ||||||||||||||
对比 | BU8871F-E2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | 3.4 mA | COMMERCIAL | DTMF SIGNALING CIRCUIT | R-PDSO-G18 | e3/e2 | Not Qualified | 70 °C | -10 °C | 260 | 10 | 18 | PLASTIC/EPOXY | SOP | SOP18,.3 | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 11.2 mm | 1.9 mm | 2363 | 2024-05-23 07:47:25 | SOIC | SOP, SOP18,.3 | 18 | compliant | 8542.39.00.01 | ||||||||
对比 | BU8872FS-T2 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | 4.4 mA | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | 2024-05-23 07:00:05 | SOIC | LSSOP, | 16 | compliant | 8542.39.00.01 | ||||||||||||
对比 | BU8872FSE1 | ROHM Semiconductor | 查询价格 | Yes | Yes | Active | 5 V | 1 | DTMF SIGNALING CIRCUIT | R-PDSO-G16 | e3/e2 | Not Qualified | 260 | 10 | 16 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 4.4 mm | 6.6 mm | 1.6 mm | 2363 | 2016-06-08 18:38:55 | SOIC | LSSOP, | 16 | unknown |