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| Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||
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| 对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | 交付时间 | YTEOL | |
| 对比 | HCS301T-I/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 6.6 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301T-I/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | |||
| 对比 | HCS301/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 6.6 V | 1 | 12 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | ||||
| 对比 | HCS200-I/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS200-I/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 6 weeks | 10 | |||
| 对比 | HCS200T/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9116 mm | 4.9 mm | 1.75 mm | HCS200T/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 4 weeks | |||||||||||
| 对比 | HCS500/SM | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | 2.4 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 3 | 70 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 5.25 mm | 5.26 mm | 2.03 mm | HCS500/SM | 2188 | 2024-11-15 23:02:25 | SOIC | 0.207 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 5 weeks | 10 | |||
| 对比 | HCS360-I/P | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 1.6 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDIP-T8 | e3 | Not Qualified | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 9.271 mm | 5.334 mm | HCS360-I/P | 2188 | 2024-11-15 23:02:25 | DIP | 0.300 INCH, PLASTIC, DIP-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 6 weeks | 10 | ||||||
| 对比 | HCS200/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9116 mm | 4.9 mm | 1.75 mm | HCS200/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 4 weeks | |||||||||||
| 对比 | HCS300/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 4 weeks | |||||||||||
| 对比 | HCS300T-I/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-I/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | |||
| 对比 | HCS300-I/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300-I/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | |||
| 对比 | HCS301T-I/SNVAO | Microchip Technology Inc | 查询价格 | Active | 6.6 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100; TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | 2188 | 2024-11-08 16:28:51 | SOIC-8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 19 | ||||||||||
| 对比 | HCS300T/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 5 weeks | |||||||||||
| 对比 | HCS301-I/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 6.6 V | 1 | 12 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301-I/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | |||
| 对比 | HCS301T/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 6.6 V | 1 | 12 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS301T/SN | 2188 | 2024-11-15 23:02:25 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 4 weeks | 10 | ||||
| 对比 | HCS300T-I/SNVAO | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-I/SNVAO | 2188 | 2024-11-08 16:07:35 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | Thailand | EAR99 | 8542.31.00.01 | 10 | ||||
| 对比 | HCS300/SN021 | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | DUAL | HCS300/SN021 | 2188 | 2024-05-23 06:20:10 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | HCS300T-I/SN035 | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-I/SN035 | 2188 | 2024-04-02 15:27:06 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | |||||||||||
| 对比 | HCS300T-/SN | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-/SN | 2188 | 2024-11-08 16:58:56 | SOIC | SOP, | 8 | compliant | Thailand | 8542.39.00.01 | 10 | ||||||
| 对比 | HCS300T/SN031 | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | COMMERCIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | DUAL | HCS300T/SN031 | 2188 | 2024-04-02 15:26:59 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.31.00.01 | |||||||||||||
| 对比 | HCS300T-I/SN036 | Microchip Technology Inc | 查询价格 | Yes | Yes | Active | 5 V | 1 | 2.5 mA | INDUSTRIAL | DATA ENCRYPTION CIRCUIT | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | HCS300T-I/SN036 | 2188 | 2024-04-02 15:17:24 | SOIC | 0.150 INCH, PLASTIC, SOIC-8 | 8 | compliant | 8542.39.00.01 | |||||||||||
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