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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 信道数量 | 收发器数量 | 数据速率 | 电信集成电路类型 | 功能数量 | 最大压摆率 | 温度等级 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 筛选级别 | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | 交付时间 | YTEOL | Source Content uid | 零件包装代码 | 针数 | 制造商包装代码 | Date Of Intro | |
对比 | RN4871-I/RM130 | Microchip Technology Inc | 查询价格 | Active | 3.3 V | 10 Mbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | XMA | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.16 mm | 2188 | 2024-11-15 23:16:17 | MODULE-16 | compliant | Thailand | 5A992.C | 8529.90.22.00 | 17 weeks 3 days | 19.99 | |||||||||||||||||||
对比 | RN4871-I/RM140 | Microchip Technology Inc | 查询价格 | Active | 3 V | 10 Mbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XXMA-N16 | 85 °C | -40 °C | TS 16949 | 16 | UNSPECIFIED | XMA | MODULE,16LEAD(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.2 mm | UNSPECIFIED | 9 mm | 11.5 mm | 2.16 mm | 2188 | 2024-11-15 23:15:04 | MODULE-16 | compliant | Thailand | 5A992.C | 8529.90.22.00 | 17 weeks 3 days | 20.46 | |||||||||||||||||||
对比 | RN4678-V/RM100 | Microchip Technology Inc | 查询价格 | Active | 3.3 V | TELECOM CIRCUIT | 1 | COMMERCIAL | R-XXMA-N33 | 70 °C | -20 °C | 33 | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | 1.1 mm | UNSPECIFIED | 12 mm | 22 mm | 2.46 mm | 2188 | 2024-11-08 17:21:30 | MODULE-33 | compliant | Thailand | 5A992.C | 8529.90.22.00 | 20 | RN4678-V/RM100 | ||||||||||||||||||||||
对比 | TLK2501IRCPR | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | HVQFP-64 | compliant | Taiwan | 5A991.B.1 | 8542.39.00.01 | 15 | TLK2501IRCPR | QFP | 64 | |||||||||
对比 | TLK2501IRCP | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | 1 | 2.5 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | HVQFP-64 | compliant | Taiwan | 5A991.B.1 | 8542.39.00.01 | 15 | TLK2501IRCP | QFP | 64 | |||||||||
对比 | AD8015ARZ-REEL7 | Analog Devices Inc | 查询价格 | No | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 26 mA | INDUSTRIAL | R-PDSO-G8 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | DUAL | 1742 | 2024-11-01 15:13:06 | PLASTIC, SOIC-8 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 8.5 | AD8015ARZ-REEL7 | SOIC | 8 | R-8 | ||||||||||||||
对比 | PN5120A0HN1/C1,151 | NXP Semiconductors | 查询价格 | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N32 | e4 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | 2245 | 2023-10-01 21:48:48 | 5 X 5 MM X 0.85 MM HEIGHT, PLASTIC, SOT-617, HVQFN-32 | compliant | 8542.39.00.01 | PN5120A0HN1/C1,151 | QFN | 32 | SOT617-1 | |||||||||||||||
对比 | CC2640R2FRGZR | Texas Instruments | 查询价格 | Yes | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N48 | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | VQFN-48 | compliant | Philippines | 5A992C | 15 | CC2640R2FRGZR | 2016-12-11 | |||||||||||||||
对比 | CC2520RHDR | Texas Instruments | 查询价格 | Yes | Yes | Active | 3 V | CMOS | 250 Mbps | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-PQCC-N28 | e4 | Not Qualified | 3 | 125 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | VQFN-28 | compliant | Malaysia | 5A992.C | 8542.39.00.01 | 15 | CC2520RHDR | QFN | 28 | ||||||||||
对比 | TLK1501IRCPR | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | HVQFP-64 | compliant | Taiwan | 5A991.B.1 | 8542.39.00.01 | 15 | TLK1501IRCPR | QFP | 64 | |||||||||
对比 | TLK1501IRCP | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | TTL | 2.5 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQFP-G64 | e4 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HVFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | HVQFP-64 | compliant | Taiwan | 5A991.B.1 | 8542.39.00.01 | 15 | TLK1501IRCP | QFP | 64 | |||||||||
对比 | CC2640R2FRGZT | Texas Instruments | 查询价格 | Yes | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N48 | e4 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | HVQCCN, | compliant | Philippines | 5A992.C | 8542.31.00.01 | 15 | CC2640R2FRGZT | 2016-12-11 | ||||||||||||||
对比 | ONET8501PBRGTT | Texas Instruments | 查询价格 | Yes | Yes | Active | 3.3 V | 11.3 Tbps | TELECOM CIRCUIT | 1 | 63 mA | INDUSTRIAL | S-PQCC-N16 | e4 | Not Qualified | 2 | 100 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | 3 X 3 MM, 0.50 MM PITCH, GREEN, PLASTIC, QFN-16 | compliant | Malaysia, Philippines | 5A991.B.1 | 8542.33.00.01 | 15 | ONET8501PBRGTT | QFN | 16 | ||||||||||
对比 | ONET8501PBRGTR | Texas Instruments | 查询价格 | Yes | Yes | Active | 3.3 V | 11.3 Tbps | TELECOM CIRCUIT | 1 | 63 mA | INDUSTRIAL | S-PQCC-N16 | e4 | Not Qualified | 1 | 100 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | 3 X 3 MM, 0.50 MM PITCH, GREEN, PLASTIC, QFN-16 | compliant | Philippines | 5A991.B.1 | 8542.33.00.01 | 15 | ONET8501PBRGTR | QFN | 16 | ||||||||||
对比 | PCM3793ARHBR | Texas Instruments | 查询价格 | Yes | Yes | Active | 3.3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N32 | e4 | Not Qualified | 2 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | QFN-32 | compliant | EAR99 | 8542.39.00.01 | 15 | PCM3793ARHBR | QFN | 32 | ||||||||||||
对比 | ATA8401C-6AQY-66 | Microchip Technology Inc | 查询价格 | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | 11.6 µA | INDUSTRIAL | S-PDSO-G8 | e3 | Not Qualified | 85 °C | -55 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | 2188 | 2024-11-15 23:17:27 | LEAD FREE, TSSOP-8 | compliant | Thailand | 5A991.G | 8542.31.00.01 | 20 weeks | 15 | ATA8401C-6AQY-66 | |||||||||||||||
对比 | AD9832BRUZ-REEL7 | Analog Devices Inc | 查询价格 | No | Yes | Active | 3.3 V | CMOS | TELECOM CIRCUIT | 1 | 5 mA | INDUSTRIAL | R-PDSO-G16 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.1 mm | 1742 | 2024-11-01 16:16:28 | TSSOP-16 | compliant | Taiwan | EAR99 | 8542.39.00.01 | 8.5 | AD9832BRUZ-REEL7 | TSSOP | 16 | RU-16 | |||||||||
对比 | TRF37B73IDSGT | Texas Instruments | 查询价格 | Yes | Yes | Active | 3.3 V | 1 | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 2 mm | 2 mm | 800 µm | 2477 | 2024-11-17 00:01:13 | HVSON, | compliant | Philippines | EAR99 | 8542.33.00.01 | 15 | TRF37B73IDSGT | ||||||||||||||
对比 | DS100BR111ASQ/NOPB | Texas Instruments | 查询价格 | Yes | Yes | Active | 2.5 V | 2 | 10.3 Tbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N24 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 800 µm | 2477 | 2024-11-17 00:01:13 | HVQCCN, | compliant | EAR99 | 8542.39.00.01 | 15 | DS100BR111ASQ/NOPB | ||||||||||||||
对比 | CC2640R2FTWRGZRQ1 | Texas Instruments | 查询价格 | Yes | Yes | Active | 3 V | 1 Gbps | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PQCC-N48 | e3 | 3 | 105 °C | -40 °C | 260 | AEC-Q100 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 7 mm | 7 mm | 1 mm | 2477 | 2024-11-17 00:01:13 | VQFN-48 | compliant | 5A992C | 15 | CC2640R2FTWRGZRQ1 | 2017-01-16 |