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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 数据速率 | 其他特性 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 针数 | 制造商包装代码 | 是否符合REACH标准 | ECCN代码 | HTS代码 | 交付时间 | 包装说明 | Country Of Origin | Date Of Intro | YTEOL | 特征 | |
对比 | TDA5051AT/C1,518 | NXP Semiconductors | 查询价格 | Yes | Active | 5 V | CMOS | 68 µA | COMMERCIAL | MODEM | R-PDSO-G16 | Not Qualified | 3 | 70 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | TDA5051AT/C1,518 | 2245 | 2024-11-08 15:49:23 | SOP | 16 | SOT162-1 | compliant | EAR99 | 8542.39.00.01 | 15 weeks | ||||||||||||||||||
对比 | DAC8742HPBSR | Texas Instruments | 查询价格 | Yes | Yes | Active | 31 Mbps | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQFP-G32 | e4 | 3 | 125 °C | -55 °C | 260 | 30 | 32 | PLASTIC/EPOXY | TFQFP | TQFP32,.28SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.2 mm | DAC8742HPBSR | 2477 | 2024-11-17 00:01:13 | compliant | EAR99 | 8542.39.00.01 | TFQFP, TQFP32,.28SQ | Taiwan | 2017-12-16 | 15 | ||||||||||||
对比 | DAC8740HRGET | Texas Instruments | 查询价格 | Yes | Yes | Active | 31 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.15SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8740HRGET | 2477 | 2024-11-17 00:01:13 | compliant | HVQCCN, LCC24,.15SQ,20 | 2017-12-16 | 15 | ||||||||||||||
对比 | DAC8741HRGET | Texas Instruments | 查询价格 | Yes | Yes | Active | 31 Mbps | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | PROGRAMMABLE MODEM | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | DAC8741HRGET | 2477 | 2024-11-17 00:01:13 | compliant | EAR99 | 8542.39.00.01 | HVQCCN, | 15 | ||||||||||||||
对比 | CPC5621ATR | IXYS Integrated Circuits Division | 查询价格 | Yes | Yes | Transferred | 3.3 V | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | 1 | 10 µA | INDUSTRIAL | MODEM-SUPPORT CIRCUIT | R-PDSO-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | SSOP | SSOP32,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 635 µm | DUAL | 7.493 mm | 10.287 mm | 2.134 mm | 1854 | 2023-08-02 12:47:38 | SOIC | 32 | unknown | 8542.39.00.01 | SSOP, SSOP32,.4 | Modem-Support Circuit | |||||||||||||
对比 | CPC5621A | IXYS Integrated Circuits Division | 查询价格 | Yes | Yes | Transferred | 3.3 V | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | 1 | 10 µA | INDUSTRIAL | MODEM-SUPPORT CIRCUIT | R-PDSO-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | SSOP | SSOP32,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 635 µm | DUAL | 7.493 mm | 10.287 mm | 2.134 mm | 1854 | 2023-08-01 20:48:56 | SOIC | 32 | unknown | 8542.39.00.01 | SSOP, SSOP32,.4 | Modem-Support Circuit | |||||||||||||
对比 | DS8500-JND+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 1 Mbps | 1 | 285 nA | INDUSTRIAL | MODEM | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | 2164 | 2023-08-05 19:28:13 | QFN | 20 | compliant | EAR99 | 8542.39.00.01 | 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-20 | Japan, Mainland China, Malaysia, Philipp... more | 9 | ||||||||||
对比 | MPL360B-I/Y8X | Microchip Technology Inc | 查询价格 | Active | 3.3 V | 1 | INDUSTRIAL | MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360B-I/Y8X | 2188 | 2024-11-08 17:20:57 | compliant | 5A992.C | 8542.39.00.01 | 4 weeks | TQFP-48 | Thailand | 20.11 | |||||||||||||||||||
对比 | MPL360B-I/SCB | Microchip Technology Inc | 查询价格 | Active | 3.3 V | 1 | INDUSTRIAL | MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360B-I/SCB | 2188 | 2024-11-08 16:29:46 | compliant | 5A992.C | 8542.39.00.01 | 4 weeks | QFN-48 | Thailand | 20.11 | |||||||||||||||||||
对比 | A5191HRTLG-XTP | onsemi | 查询价格 | Yes | Active | 3.3 V | CMOS | 1 Mbps | 1 | 600 nA | INDUSTRIAL | MODEM | S-PQFP-G32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 7 mm | 7 mm | 1.6 mm | A5191HRTLG-XTP | 2260 | 2024-10-02 20:18:25 | LQFP32, 7x7 | 32 | 561AB | compliant | 8542.39.00.01 | 10 weeks | LQFP-32 | Philippines | 0.11 | |||||||
对比 | MPL360BT-I/SCB | Microchip Technology Inc | 查询价格 | Active | 3.3 V | 1 | INDUSTRIAL | MODEM | S-XQCC-N48 | 85 °C | -40 °C | 48 | UNSPECIFIED | HVQCCN | LCC48,.25SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 6 mm | 6 mm | 900 µm | MPL360BT-I/SCB | 2188 | 2024-11-08 17:21:30 | compliant | 5A992.C | 8542.39.00.01 | 6 weeks | QFN-48 | Thailand | 20.11 | |||||||||||||||||||
对比 | MPL360BT-I/Y8X | Microchip Technology Inc | 查询价格 | Active | 3.3 V | 1 | INDUSTRIAL | MODEM | S-PQFP-G48 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | TFQFP | TQFP48,.35SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 7 mm | 7 mm | 1.2 mm | MPL360BT-I/Y8X | 2188 | 2024-11-08 16:28:51 | compliant | 5A992.C | 8542.31.00.01 | 7 weeks | TQFP-48 | Thailand | 20.11 | |||||||||||||||||||
对比 | A5191HRTPG-XTP | onsemi | 查询价格 | Yes | Active | 3.3 V | CMOS | 1 Mbps | 1 | 600 nA | INDUSTRIAL | MODEM | S-PQCC-J28 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 11.506 mm | 11.506 mm | 4.572 mm | A5191HRTPG-XTP | 2260 | 2024-10-02 20:54:22 | PLCC-28 | 28 | 776AA | compliant | 8542.39.00.01 | 4 weeks | LCC-28 | Philippines | 0.11 | |||||||
对比 | SI2457-C-FT | Skyworks Solutions Inc | 查询价格 | Yes | Active | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | 2408 | 2023-08-05 19:24:59 | compliant | ROHS COMPLIANT, TSSOP-24 | 2 | |||||||||||||||||||||
对比 | SI2404-C-FTR | Silicon Laboratories Inc | 查询价格 | Yes | Yes | Active | 3.3 V | 2.4 Gbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | 2406 | 2023-08-05 19:29:07 | TSSOP | 24 | compliant | 8542.39.00.01 | ROHS COMPLIANT, TSSOP-24 | 2 | |||||||||||||||||
对比 | SI2404-D-FS | Skyworks Solutions Inc | 查询价格 | Yes | Active | 3.3 V | 2 Mbps | 1 | COMMERCIAL | MODEM | R-PDSO-G16 | e3 | 3 | 70 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | 2408 | 2023-10-01 22:37:24 | compliant | SOIC-16 | |||||||||||||||||||||||
对比 | SI2434-C-FS | Skyworks Solutions Inc | 查询价格 | Yes | Active | 3.3 V | 33 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G16 | e3 | Not Qualified | 70 °C | 16 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | TIN | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | 2408 | 2023-10-01 22:38:40 | compliant | ROHS COMPLIANT, SOIC-16 | ||||||||||||||||||||||
对比 | SI2457-C-FTR | Skyworks Solutions Inc | 查询价格 | Yes | Active | 3.3 V | 56 Mbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | 2408 | 2023-07-31 20:15:34 | compliant | ROHS COMPLIANT, TSSOP-24 | 2 | |||||||||||||||||||||
对比 | SI2404-C-FT | Silicon Laboratories Inc | 查询价格 | Yes | Yes | Active | 3.3 V | 2.4 Gbps | 1 | COMMERCIAL | MODEM | S-PDSO-G24 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | 2406 | 2023-07-31 20:12:39 | TSSOP | 24 | compliant | 8542.39.00.01 | ROHS COMPLIANT, TSSOP-24 | 2 | |||||||||||||||||
对比 | A5191HRTNG-XTP | onsemi | 查询价格 | Yes | Active | 3.3 V | CMOS | 1 Mbps | 1 | 600 nA | INDUSTRIAL | MODEM | S-XQCC-N32 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | A5191HRTNG-XTP | 2260 | 2024-10-02 20:14:05 | QFN32, 5x5, 0.5P, 3.1x3.1EP | 32 | 488AM | compliant | 8542.39.00.01 | 10 weeks | QFN-32 | Thailand | 0.11 |