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| 对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 标称供电电压 | 技术 | 功能数量 | 最大压摆率 | 温度等级 | 电信集成电路类型 | JESD-30 代码 | JESD-609代码 | 认证状态 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度（摄氏度） | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 宽度 | 长度 | 座面最大高度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 制造商包装代码 | 是否符合REACH标准 | ECCN代码 | HTS代码 | Country Of Origin | YTEOL | 交付时间 | |
| 对比 | 82V2108PXG | Integrated Device Technology Inc | 查询价格 | Yes | Yes | Transferred | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | 82V2108PXG | 2068 | 2024-06-03 17:30:12 | PQFP | GREEN, PLASTIC, QFP-128 | 128 | PXG128 | compliant | EAR99 | 8542.39.00.01 | ||||||
| 对比 | DS34T108GN+ | Maxim Integrated Products | 查询价格 | Yes | Yes | Transferred | 1.8 V | 1 | 550 µA | INDUSTRIAL | FRAMER | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | 2164 | 2023-08-02 04:55:39 | BGA | BGA, BGA484,22X22,40 | 484 | compliant | EAR99 | 8542.39.00.01 | Japan, Mainland China, Malaysia, Philipp... more | 3 | ||||||
| 对比 | PM4358-NGI | Microchip Technology Inc | 查询价格 | Active | 1.8 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | 2188 | 2024-11-15 23:12:53 | BGA, | compliant | 5A991.B | 8542.31.00.01 | Thailand | 19 | 9 weeks | |||||||||||||||||||
| 对比 | MT8979APR1 | Microchip Technology Inc | 查询价格 | Yes | Active | 5 V | CMOS | 1 | 16 mA | INDUSTRIAL | FRAMER | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | 2188 | 2024-06-03 15:34:08 | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | ||||||||||||||||
| 对比 | DS2154LA2+ | Rochester Electronics LLC | 查询价格 | Yes | Yes | Active | 5 V | CMOS | 1 | COMMERCIAL | FRAMER | S-PQFP-G100 | e3 | COMMERCIAL | 3 | 70 °C | 260 | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | 2178096 | 2016-06-20 18:00:17 | QFP | 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100 | 100 | unknown | ||||||||||||
| 对比 | TFRA84J131BL-3 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | BGA909,34X34,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1778 | 2023-08-01 20:34:36 | BGA, BGA909,34X34,40 | compliant | 8542.39.00.01 | |||||||||||||||||
| 对比 | PM4351-RGI | Microchip Technology Inc | 查询价格 | Yes | Active | 3.3 V | CMOS | 1 | INDUSTRIAL | FRAMER | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | 2188 | 2024-11-15 23:12:53 | CABGA-81 | compliant | 5A991.B | 8542.31.00.01 | Thailand | 19 | 9 weeks | |||||||||||||||||
| 对比 | TTSI004161BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2022-06-02 12:37:02 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TFRA84J131BL-3 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1778 | 2024-07-10 20:14:56 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TTSI001041BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2024-07-10 19:46:05 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | TTSI001041BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | TTSI001041BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | TTSI004161BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TTSI004161BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2024-07-10 18:21:11 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TFRA84J131BL-3 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | FRAMER | S-PBGA-B909 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 909 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | 1807 | 2024-07-10 20:14:56 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | TTSI002081BL-2 | Broadcom Limited | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1807 | 2022-06-02 12:37:02 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TTSI001041BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2024-07-10 19:46:05 | BGA, | compliant | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TTSI004161BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2024-07-10 18:21:11 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||
| 对比 | TTSI002081BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2022-06-02 12:37:02 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||
| 对比 | L-TTSI002081BL-2 | Avago Technologies | 查询价格 | Active | 1.5 V | 1 | INDUSTRIAL | TIME SLOT ASSIGNER | S-PBGA-B240 | e1 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | 1778 | 2024-07-10 19:56:01 | BGA, | unknown | 8542.39.00.01 | ||||||||||||||||
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