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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 内存集成电路类型 | 其他特性 | 混合内存类型 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | ECCN代码 | HTS代码 | Source Content uid | 制造商包装代码 | Country Of Origin | Date Of Intro | YTEOL | 交付时间 | |
对比 | MR2A16ACYS35 | Everspin Technologies | 查询价格 | Yes | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 28 mA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | 2024-03-02 20:13:37 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||
对比 | MR25H10CDF | Everspin Technologies | 查询价格 | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | MEMORY CIRCUIT | 1 | 128000 | 131.072 k | SYNCHRONOUS | 115 µA | 27 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 900 µm | 6 mm | 5 mm | 1623927 | 2024-03-02 19:00:19 | SON | DFN-8 | 8 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||
对比 | DS2401+ | Analog Devices Inc | 查询价格 | Yes | Active | 64 bit | 1 | 64X1 | 5 V | MEMORY CIRCUIT | 1 | 64 | 64 words | ASYNCHRONOUS | 6 V | 2.8 V | CMOS | INDUSTRIAL | O-PBCY-T3 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 250 | 30 | 3 | PLASTIC/EPOXY | TO-92 | ROUND | CYLINDRICAL | NO | Matte Tin (Sn) | THROUGH-HOLE | BOTTOM | 1742 | 2024-11-01 18:01:10 | 3-TO92-N/A | TO-92, 3 PIN | 3 | compliant | DS2401+ | 3-TO92-N/A | Japan, Mainland China, Malaysia, Philipp... more | 2002-02-22 | 8.5 | |||||||||||||||||
对比 | 47L16-I/P | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDIP-T8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | 2188 | 2024-11-15 23:06:55 | DIP-8 | compliant | EAR99 | 8542.32.00.51 | 47L16-I/P | Thailand | 2016-10-10 | 19.96 | 6 weeks | ||||||||||||||
对比 | DS2401P+T&R | Analog Devices Inc | 查询价格 | Yes | Active | 64 bit | 1 | 64X1 | 5 V | MEMORY CIRCUIT | 1 | 64 | 64 words | ASYNCHRONOUS | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-C6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOC | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | C BEND | 1.27 mm | DUAL | 1.5 mm | 3.94 mm | 3.76 mm | 1742 | 2024-11-01 18:41:58 | 6-PLCC-N/A | 6 | DS2401P+T&R | 6-PLCC-N/A | Japan, Mainland China, Malaysia, Philipp... more | 2002-02-22 | 8.5 | ||||||||||||||
对比 | DS2411P+T&R | Analog Devices Inc | 查询价格 | Yes | Active | 64 bit | 1 | 64X1 | MEMORY CIRCUIT | 1 | 64 | 64 words | ASYNCHRONOUS | 1 µA | 100 nA | 5.25 V | 1.5 V | CMOS | INDUSTRIAL | R-PDSO-C6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOC | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | C BEND | 1.27 mm | DUAL | 1.5 mm | 3.94 mm | 3.76 mm | 1742 | 2024-11-01 18:28:02 | 6-PLCC-N/A | 6 | DS2411P+T&R | 6-PLCC-N/A | Japan, Mainland China, Malaysia, Philipp... more | 2003-02-10 | 8.5 | |||||||||||||
对比 | DS2401A+ | Analog Devices Inc | 查询价格 | Yes | Active | MEMORY CIRCUIT | e3 | 250 | Matte Tin (Sn) | 1742 | 2024-11-01 18:02:02 | 3-TO92-N/A | 3 | compliant | DS2401A+ | 3-TO92-N/A | Japan, Mainland China, Malaysia, Philipp... more | 2002-02-22 | 8.5 | ||||||||||||||||||||||||||||||||||||||||||||
对比 | FM31256-GTR | Infineon Technologies AG | 查询价格 | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3 V | 550 ns | MEMORY CIRCUIT | 0.9ms TAA available @400khz and 3ms TAA available @ 100 khz | 1 | 32000 | 32.768 k | SYNCHRONOUS | 5.5 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G14 | e3 | 3 | 85 °C | -40 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.727 mm | 8.6483 mm | 3.8985 mm | 2065 | 2024-11-15 23:19:00 | SOIC-14 | compliant | 2 days | |||||||||||||||||||
对比 | 47C16-I/SN | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | 2024-11-15 23:06:55 | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | 47C16-I/SN | Thailand | 2016-10-10 | 20.42 | 6 weeks | ||||||||||
对比 | MR2A16AYS35 | Everspin Technologies | 查询价格 | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 28 mA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G44 | Not Qualified | 3 | 70 °C | 260 | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | 2024-03-02 19:02:27 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||
对比 | MR2A16AVYS35 | Everspin Technologies | 查询价格 | Yes | Active | 4.1943 Mbit | 16 | 256KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 28 mA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | 3 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | 2024-03-02 20:32:44 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 | |||||||||||||||
对比 | 47L04-I/SN | Microchip Technology Inc | 查询价格 | Yes | Active | 4.096 kbit | 8 | 512X8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | 2024-11-15 23:06:55 | compliant | EAR99 | 8542.32.00.51 | 47L04-I/SN | Thailand | 2016-10-10 | 20.42 | 8 weeks | ||||||||||||
对比 | 47L04-I/ST | Microchip Technology Inc | 查询价格 | Yes | Active | 4.096 kbit | 8 | 512X8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | 2024-11-15 23:06:55 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47L04-I/ST | Thailand | 2016-10-10 | 20.42 | 7 weeks | |||||||||||
对比 | 47L16-I/ST | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | 2188 | 2024-11-15 23:06:55 | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | 47L16-I/ST | Thailand | 2016-10-10 | 19.96 | 8 weeks | |||||||||||
对比 | 47L16-I/SN | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | 2024-11-15 23:16:17 | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | 47L16-I/SN | Thailand | 2016-10-10 | 19.96 | 10 weeks 4 days | |||||||||||
对比 | 47L16-E/SN | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | AUTOMOTIVE | R-PDSO-G8 | e3 | 3 | 125 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | 2188 | 2024-11-15 23:06:55 | SOIC-8 | compliant | EAR99 | 8542.32.00.71 | 47L16-E/SN | Thailand | 2016-10-10 | 19.96 | 6 weeks | |||||||||||
对比 | 47L04-I/P | Microchip Technology Inc | 查询价格 | Yes | Active | 4.096 kbit | 8 | 512X8 | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 512 | 512 words | SYNCHRONOUS | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDIP-T8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | 2188 | 2024-11-15 23:06:55 | DIP-8 | compliant | EAR99 | 8542.32.00.51 | 47L04-I/P | Thailand | 2016-10-10 | 20.42 | 4 weeks | ||||||||||||||
对比 | 47C16-I/P | Microchip Technology Inc | 查询价格 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 400 ns | MEMORY CIRCUIT | EEPROM+SRAM | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | 2188 | 2024-11-15 23:06:55 | DIP-8 | compliant | EAR99 | 8542.32.00.51 | 47C16-I/P | Thailand | 2016-10-10 | 20.42 | 4 weeks | |||||||||||||
对比 | DS2401Z+T&R | Analog Devices Inc | 查询价格 | Yes | Active | 64 bit | 1 | 64X1 | 5 V | MEMORY CIRCUIT | 1 | 64 | 64 words | ASYNCHRONOUS | 6 V | 2.8 V | CMOS | INDUSTRIAL | R-PDSO-G4 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | SOP | SOT-223 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 2.3 mm | DUAL | 1.8 mm | 6.5 mm | 3.5 mm | 1742 | 2024-11-01 16:44:38 | 3-SOT_223-N/A | SOT-223, 4 PIN | 3 | compliant | DS2401Z+T&R | 3-SOT_223-N/A | Japan, Mainland China, Malaysia, Philipp... more | 2002-02-22 | 8.5 | ||||||||||||
对比 | MR0A16ACYS35 | Everspin Technologies | 查询价格 | Yes | Active | 1.0486 Mbit | 16 | 64KX16 | 3.3 V | 35 ns | MEMORY CIRCUIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 28 mA | 165 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G44 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 18.41 mm | 10.16 mm | 1623927 | 2024-03-02 19:23:04 | TSOP2 | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 44 | compliant | EAR99 | 8542.32.00.71 |