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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 最大时钟频率 (fCLK) | 周期时间 | 内存集成电路类型 | 其他特性 | 备用内存宽度 | 功能数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 可输出 | 并行/串行 | 最大待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | Source Content uid | mfrid | Modified On | 零件包装代码 | 包装说明 | 针数 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | YTEOL | 制造商包装代码 | 交付时间 | |
对比 | SN74V293-7PZA | Texas Instruments | 查询价格 | Yes | Yes | Active | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 5 ns | 166 MHz | 7.5 ns | OTHER FIFO | CAN ALSO BE CONFIGURED AS 131072 X 9 | 9 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e4 | 4 | 70 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | SN74V293-7PZA | 2477 | 2024-11-17 00:01:13 | QFP | GREEN, PLASTIC, LQFP-80 | 80 | compliant | Taiwan | 3A991.B.2.B | 8542.32.00.71 | 15 | |||||
对比 | SN74V293PZAEP | Texas Instruments | 查询价格 | Yes | Yes | Active | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 5 ns | 133 MHz | 7.5 ns | OTHER FIFO | CAN ALSO BE CONFIGURED AS 131072 X 9 | 9 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | MILITARY | S-PQFP-G80 | Not Qualified | e4 | 4 | 125 °C | -55 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | SN74V293PZAEP | 2477 | 2024-11-17 00:01:13 | QFP | TQFP-80 | 80 | compliant | Taiwan | 3A991.B.2.B | 8542.32.00.71 | 15 | ||||
对比 | CD40105BE | Texas Instruments | 查询价格 | Yes | Active | 64 bit | 4 | 16X4 | 5 V | 420 ns | 1.5 MHz | OTHER FIFO | 1 | 16 | 16 words | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 18 V | 3 V | CMOS | MILITARY | R-PDIP-T16 | Not Qualified | e4 | 125 °C | -55 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 19.305 mm | 7.62 mm | CD40105BE | 2477 | 2024-11-17 00:01:13 | DIP | ROHS COMPLIANT, PLASTIC, DIP-16 | 16 | compliant | Malaysia, Mexico | EAR99 | 8542.39.00.01 | 15 | |||||||||||||
对比 | 7205L15JGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 73.728 kbit | 9 | 8KX9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 7205L15JGI | 2354 | 2024-11-15 23:04:49 | PLCC | 32 | compliant | NLR | 8542320071 | 4.9 | PLG32 | 18 weeks | ||||||
对比 | 7204L12TPG | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 36.864 kbit | 9 | 4KX9 | 5 V | 12 ns | 50 MHz | 20 ns | BI-DIRECTIONAL FIFO | 1 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 70 °C | 260 | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) - annealed | THROUGH-HOLE | DUAL | 7204L12TPG | 2354 | 2024-11-15 23:03:09 | PDIP | 28 | compliant | NLR | 8542320071 | 4.85 | PTG28 | 18 weeks | |||||||||||||
对比 | 7202LA15JGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 9.216 kbit | 9 | 1KX9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 7202LA15JGI | 2354 | 2024-11-15 23:02:25 | PLCC | GREEN, PLASTIC, LCC-32 | 32 | compliant | NLR | 8542320071 | 4.9 | PLG32 | 18 weeks | |||||
对比 | 72V36110L7-5PFGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 40 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | R-PQFP-G128 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 20 mm | 14 mm | 72V36110L7-5PFGI | 2354 | 2024-11-15 23:04:18 | TQFP | 128 | compliant | NLR | 8542320071 | 5.6 | PKG128 | 18 weeks | |||||||
对比 | 7208L25JGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 28.5 MHz | 35 ns | BI-DIRECTIONAL FIFO | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 7208L25JGI | 2354 | 2024-11-15 23:31:08 | PLCC | 32 | compliant | NLR | 8542320071 | 4.75 | PLG32 | 18 weeks | ||||||
对比 | 72V245L15TFGI | Renesas Electronics Corporation | 查询价格 | Yes | Active | 73.728 kbit | 18 | 4KX18 | 3.3 V | 10 ns | 100 MHz | 15 ns | OTHER FIFO | 1 | 4000 | 4.096 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 1.6 mm | 10 mm | 10 mm | 72V245L15TFGI | 2354 | 2024-11-15 23:31:08 | TQFP | LFQFP, QFP64,.47SQ,20 | 64 | compliant | EAR99 | 8542.32.00.71 | 4.95 | PPG64 | 18 weeks | |||||||
对比 | 72V245L10PFG | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 73.728 kbit | 18 | 4KX18 | 3.3 V | 6.5 ns | 100 MHz | 10 ns | OTHER FIFO | EASILY EXPANDABLE IN DEPTH AND WIDTH | 1 | 4000 | 4.096 k | SYNCHRONOUS | YES | PARALLEL | 5 mA | 30 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V245L10PFG | 2354 | 2024-11-15 23:31:08 | TQFP | 64 | compliant | NLR | 8542320071 | 4.95 | PNG64 | 18 weeks | |||||||
对比 | 72V2111L15PFGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 4.7186 Mbit | 9 | 512KX9 | 3.3 V | 10 ns | 66.7 MHz | 15 ns | OTHER FIFO | 1 | 512000 | 524.288 k | SYNCHRONOUS | YES | PARALLEL | 20 mA | 55 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.63SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | 72V2111L15PFGI | 2354 | 2024-11-15 23:03:30 | TQFP | 64 | compliant | NLR | 8542320071 | 5.4 | PNG64 | 18 weeks | ||||||||
对比 | SN74V263PZAEP | Texas Instruments | 查询价格 | Yes | Yes | Active | 147.456 kbit | 18 | 8KX18 | 3.3 V | 5 ns | 133 MHz | 7.5 ns | OTHER FIFO | CAN ALSO BE CONFIGURED AS 16384 X 9 | 9 | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | MILITARY | S-PQFP-G80 | Not Qualified | e4 | 4 | 125 °C | -55 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | SN74V263PZAEP | 2477 | 2024-11-17 00:01:13 | QFP | TQFP-80 | 80 | compliant | Taiwan | 3A991.B.2.B | 8542.32.00.71 | 15 | ||||
对比 | CD74HC40105M96 | Texas Instruments | 查询价格 | Yes | Yes | Active | 64 bit | 4 | 16X4 | 4.5 V | 2.25 µs | 10 MHz | 500 ns | OTHER FIFO | 1 | 16 | 16 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 6 V | 2 V | CMOS | MILITARY | R-PDSO-G16 | Not Qualified | e4 | 1 | 125 °C | -55 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 9.9 mm | 3.9 mm | CD74HC40105M96 | 2477 | 2024-11-17 00:01:13 | SOIC | SOIC-16 | 16 | compliant | Mexico | EAR99 | 8542.39.00.01 | 15 | ||||||||
对比 | 7204L12JG8 | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 36.864 kbit | 9 | 4KX9 | 5 V | 12 ns | 50 MHz | 20 ns | BI-DIRECTIONAL FIFO | 1 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 7204L12JG8 | 2354 | 2024-11-15 23:07:36 | PLCC | 32 | compliant | NLR | 8542320071 | 4.9 | PLG32 | 18 weeks | |||||||
对比 | SN74ALVC7804-40DL | Texas Instruments | 查询价格 | Yes | Yes | Active | 9.216 kbit | 18 | 512X18 | 3.3 V | 24 ns | 25 MHz | 40 ns | OTHER FIFO | 1 | 512 | 512 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 500 nA | 3.6 V | 3.3 V | CMOS | COMMERCIAL | R-PDSO-G56 | Not Qualified | e4 | 1 | 70 °C | 260 | 30 | 56 | PLASTIC/EPOXY | SSOP | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 635 µm | DUAL | 2.79 mm | 18.415 mm | 7.5 mm | SN74ALVC7804-40DL | 2477 | 2024-11-01 16:11:15 | SSOP | SSOP, SSOP56,.4 | 56 | compliant | Malaysia | EAR99 | 8542.39.00.01 | 15 | ||||||||
对比 | CD74HC40105E | Texas Instruments | 查询价格 | Yes | Active | 64 bit | 4 | 16X4 | 4.5 V | 2.25 µs | 10 MHz | 500 ns | OTHER FIFO | 1 | 16 | 16 words | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 6 V | 2 V | CMOS | MILITARY | R-PDIP-T16 | Not Qualified | e4 | 125 °C | -55 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Nickel/Palladium/Gold (Ni/Pd/Au) | THROUGH-HOLE | 2.54 mm | DUAL | 5.08 mm | 19.305 mm | 7.62 mm | CD74HC40105E | 2477 | 2024-11-17 00:01:13 | DIP | DIP-16 | 16 | compliant | Malaysia, Mexico | EAR99 | 8542.39.00.01 | 15 | ||||||||||||
对比 | SN74V293-6PZA | Texas Instruments | 查询价格 | Yes | Yes | Active | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 4.5 ns | 166 MHz | 6 ns | OTHER FIFO | CAN ALSO BE CONFIGURED AS 131072 X 9 | 9 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e4 | 4 | 70 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | SN74V293-6PZA | 2477 | 2024-11-17 00:01:13 | QFP | GREEN, PLASTIC, LQFP-80 | 80 | compliant | Taiwan | EAR99 | 8542.32.00.71 | 15 | |||||
对比 | 7208L20JG | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 589.824 kbit | 9 | 64KX9 | 5 V | 20 ns | 33.3 MHz | 30 ns | BI-DIRECTIONAL FIFO | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | 7208L20JG | 2354 | 2024-11-15 23:04:18 | PLCC | 32 | compliant | NLR | 8542320071 | 4.75 | PLG32 | 18 weeks | |||||||
对比 | SN74V283PZAEP | Texas Instruments | 查询价格 | Yes | Yes | Active | 589.824 kbit | 18 | 32KX18 | 3.3 V | 5 ns | 133 MHz | 7.5 ns | OTHER FIFO | CAN ALSO BE CONFIGURED AS 65536 X 9 | 9 | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | MILITARY | S-PQFP-G80 | Not Qualified | e4 | 4 | 125 °C | -55 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | SN74V283PZAEP | 2477 | 2024-11-17 00:01:13 | QFP | TQFP-80 | 80 | compliant | Taiwan | 3A991.B.2.B | 8542.32.00.71 | 15 | ||||
对比 | 72V06L25JGI | Renesas Electronics Corporation | 查询价格 | Yes | Yes | Active | 147.456 kbit | 9 | 16KX9 | 3.3 V | 25 ns | 35 ns | OTHER FIFO | RETRANSMIT | 1 | 16000 | 16.384 k | ASYNCHRONOUS | NO | PARALLEL | 75 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | 72V06L25JGI | 2354 | 2024-11-15 23:07:36 | PLCC | 32 | compliant | NLR | 8542320071 | 4.9 | PLG32 | 18 weeks |