EPROM_EPROM型号_EPROM参数-datasheet5电子元器件查询网

								Most Relevant						Technical																									Compliance			Operating Conditions						Physical											Dimensions			Other
对比	制造商型号	制造商	综合价格	风险等级	是否无铅	是否Rohs认证	生命周期	内存密度	内存宽度	组织	标称供电电压 (Vsup)	最长访问时间	最大时钟频率 (fCLK)	内存集成电路类型	其他特性	备用内存宽度	数据保留时间-最小值	耐久性	I/O 类型	功能数量	端口数量	字数代码	字数	工作模式	输出特性	并行/串行	编程电压	反向引出线	串行总线类型	最大待机电流	最大压摆率	最大供电电压 (Vsup)	最小供电电压 (Vsup)	技术	温度等级	类型	最长写入周期时间 (tWC)	写保护	JESD-30 代码	认证状态	JESD-609代码	湿度敏感等级	最高工作温度	最低工作温度	峰值回流温度（摄氏度）	筛选级别	处于峰值回流温度下的最长时间	端子数量	封装主体材料	封装代码	封装等效代码	封装形状	封装形式	表面贴装	端子面层	端子形式	端子节距	端子位置	座面最大高度	长度	宽度	Source Content uid	mfrid	Modified On	包装说明	是否符合REACH标准	Country Of Origin	ECCN代码	HTS代码	交付时间	YTEOL	零件包装代码	针数	制造商包装代码
对比	AT93C46DN-SH-B	Microchip Technology Inc	查询价格	低	Yes	Yes	Active	1.024 kbit	16	64X16	5 V		2 MHz	EEPROM	ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN	8	100	1000000 Write/Erase Cycles	SEPARATE	1	1	64	64 words	SYNCHRONOUS	3-STATE	SERIAL	5 V	NO	3-WIRE	15 µA	2 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDSO-G8	Not Qualified	e3	1	85 °C	-40 °C	260		40	8	PLASTIC/EPOXY	SOP	SOP8,.23	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL	1.75 mm	4.9 mm	3.9 mm	AT93C46DN-SH-B	2188	2025-03-28 23:09:15	SOIC-8	compliant		3A991.A.2	8542.31.00.01	6 weeks
对比	CAT24C128WI-GT3	onsemi	查询价格	低	Yes	Yes	Active	131.072 kbit	8	16KX8	3.3 V		1 MHz	EEPROM	5MICROAMP STANDBY CURRENT AVAILABLE @ 12... more	1	100	1000000 Write/Erase Cycles		1		16000	16.384 k	SYNCHRONOUS	OPEN-DRAIN	SERIAL	3.3 V		I2C	2 µA	3 µA	5.5 V	2.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDSO-G8	Not Qualified	e4	1	85 °C	-40 °C	260		30	8	PLASTIC/EPOXY	SOP	SOP8,.25	RECTANGULAR	SMALL OUTLINE	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	1.27 mm	DUAL	1.75 mm	4.9 mm	3.9 mm	CAT24C128WI-GT3	2260	2025-02-04 18:29:09		compliant		EAR99	8542.32.00.51			SOIC 8, 150 mils	8	751BD
对比	AT93C46E-TH-B	Microchip Technology Inc	查询价格	低	Yes	Yes	Active	1.024 kbit	16	64X16	5 V		2 MHz	EEPROM	ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN		100	1000000 Write/Erase Cycles	SEPARATE	1	1	64	64 words	SYNCHRONOUS	3-STATE	SERIAL	5 V	NO	3-WIRE	15 µA	2 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDSO-G8	Not Qualified	e4	1	85 °C	-40 °C	260		40	8	PLASTIC/EPOXY	TSSOP	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	NICKEL PALLADIUM GOLD	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	3 mm	AT93C46E-TH-B	2188	2025-03-28 23:13:49	TSSOP-8	compliant		3A991.A.2	8542.31.00.01	5 weeks 4 days
对比	AT93C46EN-SH-T	Microchip Technology Inc	查询价格	低	Yes	Yes	Active	1.024 kbit	16	64X16	5 V		2 MHz	EEPROM	ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN		100	1000000 Write/Erase Cycles	SEPARATE	1	1	64	64 words	SYNCHRONOUS	3-STATE	SERIAL	5 V	NO	3-WIRE	15 µA	2 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDSO-G8	Not Qualified	e3	3	85 °C	-40 °C	260		40	8	PLASTIC/EPOXY	SOP	SOP8,.23	RECTANGULAR	SMALL OUTLINE	YES	Matte Tin (Sn)	GULL WING	1.27 mm	DUAL	1.75 mm	4.9 mm	3.9 mm	AT93C46EN-SH-T	2188	2025-03-28 23:06:19	SOIC-8	compliant		3A991.A.2	8542.31.00.01	6 weeks
对比	AT93C46E-PU	Microchip Technology Inc	查询价格	低	Yes	Yes	Active	1.024 kbit	16	64X16	5 V		2 MHz	EEPROM	ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN		100	1000000 Write/Erase Cycles	SEPARATE	1	1	64	64 words	SYNCHRONOUS	3-STATE	SERIAL	5 V	NO	3-WIRE	15 µA	2 µA	5.5 V	4.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDIP-T8	Not Qualified	e3		85 °C	-40 °C				8	PLASTIC/EPOXY	DIP	DIP8,.3	RECTANGULAR	IN-LINE	NO	Matte Tin (Sn)	THROUGH-HOLE	2.54 mm	DUAL	5.334 mm	9.271 mm	7.62 mm	AT93C46E-PU	2188	2025-03-28 23:05:26	DIP-8	compliant		3A991.A.2	8542.31.00.01	6 weeks
对比	CAT24C128YI-GT3	onsemi	查询价格	低	Yes	Yes	Active	131.072 kbit	8	16KX8	3.3 V		1 MHz	EEPROM	5MICROAMP STANDBY CURRENT AVAILABLE @ 12... more	1	100	1000000 Write/Erase Cycles		1		16000	16.384 k	SYNCHRONOUS	OPEN-DRAIN	SERIAL	3.3 V		I2C	2 µA	3 µA	5.5 V	2.5 V	CMOS	INDUSTRIAL		5 ms	HARDWARE	R-PDSO-G8	Not Qualified	e4	1	85 °C	-40 °C	260		30	8	PLASTIC/EPOXY	TSSOP	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	YES	Nickel/Palladium/Gold (Ni/Pd/Au)	GULL WING	650 µm	DUAL	1.2 mm	4.4 mm	3 mm	CAT24C128YI-GT3	2260	2025-03-29 00:20:47		compliant		EAR99	8542.32.00.51	9 weeks		TSSOP8, 4.4x3	8	948AL
对比	MX25L25645GZ2I-08G	Macronix International Co Ltd	查询价格	低		Yes	Active	268.4355 Mbit	8	32MX8	3 V		120 MHz	FLASH			20	100000 Write/Erase Cycles		1		32000000	33.5544 M	SYNCHRONOUS	3-STATE	SERIAL	3 V		SPI	20 µA	25 µA	3.6 V	2.7 V	CMOS	INDUSTRIAL	NOR TYPE		HARDWARE/SOFTWARE	R-XDSO-N8		e3		85 °C	-40 °C				8	UNSPECIFIED	HVSON	SOLCC8,.3	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES	Tin (Sn)	NO LEAD	1.27 mm	DUAL	800 µm	8 mm	6 mm		4307504	2025-03-28 23:16:25	WSON-8	compliant		EAR99	8542.32.00.51	10 weeks
对比	MX25L25645GZNI-08G	Macronix International Co Ltd	查询价格	低		Yes	Active	268.4355 Mbit	8	32MX8	3 V		120 MHz	FLASH			20	100000 Write/Erase Cycles		1		32000000	33.5544 M	SYNCHRONOUS	3-STATE	SERIAL	3 V		SPI	20 µA	25 µA	3.6 V	2.7 V	CMOS	INDUSTRIAL	NOR TYPE		HARDWARE/SOFTWARE	R-XDSO-N8				85 °C	-40 °C	NOT SPECIFIED		NOT SPECIFIED	8	UNSPECIFIED	HVSON	SOLCC8,.25	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	YES		NO LEAD	1.27 mm	DUAL	800 µm	6 mm	5 mm		4307504	2025-03-28 23:16:25	WSON-8	compliant		EAR99	8542.32.00.51	10 weeks
对比	MX25L25645GM2I-08G	Macronix International Co Ltd	查询价格	低		Yes	Active	268.4355 Mbit	8	32MX8	3 V		120 MHz	FLASH			20	100000 Write/Erase Cycles		1		32000000	33.5544 M	SYNCHRONOUS	3-STATE	SERIAL	3 V		SPI	20 µA	25 µA	3.6 V	2.7 V	CMOS	INDUSTRIAL	NOR TYPE		HARDWARE/SOFTWARE	R-PDSO-G8				85 °C	-40 °C	NOT SPECIFIED		NOT SPECIFIED	8	PLASTIC/EPOXY	SOP	SOP8,.3	RECTANGULAR	SMALL OUTLINE	YES		GULL WING	1.27 mm	DUAL	2.16 mm	5.28 mm	5.23 mm		4307504	2025-03-28 23:16:25	SOP-8	compliant		EAR99	8542.32.00.51	10 weeks
对比	MD27C256-25/B	Rochester Electronics LLC	查询价格	低		No	Active	262.144 kbit	8	32KX8	5 V	250 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					30 µA	5.5 V	4.5 V	CMOS	MILITARY				R-CQCC-J32				125 °C	-55 °C	NOT SPECIFIED		NOT SPECIFIED	32	CERAMIC, METAL-SEALED COFIRED	QCCJ		RECTANGULAR	CHIP CARRIER	YES		J BEND	1.27 mm	QUAD	4.2418 mm	15.04 mm	11.557 mm		2178096	2025-01-13 13:22:49	CERAMIC, JLCC-32	unknown		3A001.A.2.C	8542.32.00.61	4 weeks
对比	QP27C256-200/QYA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	200 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2024-04-02 15:50:08	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256-200/YA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	200 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2025-03-29 00:19:53	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256L-200/YA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	200 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2024-05-23 05:57:55	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256L-200/XA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	200 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2024-04-02 15:48:18	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256-200/XA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	200 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2025-03-29 00:19:53	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256L-250/ZA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	250 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					60 µA	5.5 V	4.5 V	CMOS	MILITARY				R-CQCC-N32	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD					1937079	2024-04-02 15:27:56	CERAMIC, LCC-32	compliant		3A001.A.2.C	8542.32.00.61			QFJ	32
对比	QP27C256-55/YA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	55 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2025-03-29 00:20:00	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	QP27C256-55/QYA	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	55 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-GDIP-T28	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		28	CERAMIC, GLASS-SEALED	DIP		RECTANGULAR	IN-LINE	NO		THROUGH-HOLE		DUAL					1937079	2024-05-23 06:28:44	HERMETIC SEALED, CERAMIC, DIP-28	compliant		3A001.A.2.C	8542.32.00.61			DIP	28
对比	5962-8606312QYX	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	250 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					25 µA	5.5 V	4.5 V	CMOS	MILITARY				R-CQCC-N32	Not Qualified	e0		125 °C	-55 °C		MIL-PRF-38535 Class Q		32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES	TIN LEAD	NO LEAD		QUAD					1937079	2024-07-10 18:47:44	CERAMIC, LCC-32	compliant		3A001.A.2.C	8542.32.00.61			QFJ	32
对比	QP27C256L-250/YC	Teledyne e2v	查询价格	高			Active	262.144 kbit	8	32KX8	5 V	250 ns		UVPROM						1		32000	32.768 k	ASYNCHRONOUS		PARALLEL					60 µA	5.5 V	4.5 V	CMOS	MILITARY				R-CQCC-N32	Not Qualified			125 °C	-55 °C		MIL-STD-883 Class B		32	CERAMIC, METAL-SEALED COFIRED	QCCN		RECTANGULAR	CHIP CARRIER	YES		NO LEAD		QUAD					1937079	2024-04-02 15:50:42	CERAMIC, LCC-32	compliant		3A001.A.2.C	8542.32.00.61			QFJ	32

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