Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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对比 | 制造商型号 | 制造商 | 综合价格 | 风险等级 | 是否无铅 | 是否Rohs认证 | 生命周期 | 内存密度 | 内存宽度 | 组织 | 标称供电电压 (Vsup) | 最长访问时间 | 最大时钟频率 (fCLK) | 刷新周期 | 访问模式 | 内存集成电路类型 | 其他特性 | I/O 类型 | 交错的突发长度 | 功能数量 | 端口数量 | 字数代码 | 字数 | 工作模式 | 输出特性 | 自我刷新 | 连续突发长度 | 最大待机电流 | 最小待机电流 | 最大压摆率 | 最大供电电压 (Vsup) | 最小供电电压 (Vsup) | 技术 | 温度等级 | JESD-30 代码 | 认证状态 | JESD-609代码 | 湿度敏感等级 | 最高工作温度 | 最低工作温度 | 峰值回流温度(摄氏度) | 处于峰值回流温度下的最长时间 | 端子数量 | 封装主体材料 | 封装代码 | 封装等效代码 | 封装形状 | 封装形式 | 表面贴装 | 端子面层 | 端子形式 | 端子节距 | 端子位置 | 座面最大高度 | 长度 | 宽度 | mfrid | Modified On | 包装说明 | 是否符合REACH标准 | Country Of Origin | ECCN代码 | HTS代码 | 交付时间 | YTEOL | 零件包装代码 | 针数 | Date Of Intro | |
对比 | AS4C4M16SA-7TCN | Alliance Memory Inc | 查询价格 | Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:06:55 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 8 weeks | 4 | |||||||||||||||||||||
对比 | MT41K128M16JT-125:K | Micron Technology Inc | 查询价格 | Yes | Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.35 V | 225 ps | 800 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 8 | 12 mA | 195 µA | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | Not Qualified | e1 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | 2190 | 2024-11-15 23:16:17 | compliant | EAR99 | 8542.32.00.36 | 14 weeks 1 day | 5.1 | BGA | 96 | ||||||||
对比 | AS4C4M16SA-6TIN | Alliance Memory Inc | 查询价格 | Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G54 | 3 | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:06:55 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 8 weeks | 4 | ||||||||||||||||||||
对比 | AS4C8M16SA-7TCN | Alliance Memory Inc | 查询价格 | Yes | Active | 134.2177 Mbit | 16 | 8MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:06:55 | 0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 10 weeks | 4 | ||||||||||||||||||||
对比 | MT41K256M16TW-107:P | Micron Technology Inc | 查询价格 | Yes | Active | 4.295 Gbit | 16 | 256MX16 | 1.35 V | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | YES | 1.45 V | 1.283 V | CMOS | OTHER | R-PBGA-B96 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | 2190 | 2024-11-15 23:16:17 | FBGA-96 | not_compliant | EAR99 | 8542.32.00.36 | 14 weeks 1 day | 5.15 | ||||||||||||||||||||||
对比 | AS4C4M16SA-6TINTR | Alliance Memory Inc | 查询价格 | Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | e3 | 3 | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin (Sn) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 1689 | 2024-11-15 23:10:23 | FBGA-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 8 weeks | 4 | 2018-10-04 | ||||||||||||||||||
对比 | AS4C16M16SA-7TCNTR | Alliance Memory Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | 143 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 1,2,4,8,FP | 20 mA | 55 µA | 3.6 V | 3 V | CMOS | R-PDSO-G54 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:11:22 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 8 weeks | 4 | |||||||||||||||
对比 | MT41K64M16TW-107:J | Micron Technology Inc | 查询价格 | Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 1.35 V | 195 ps | 933 MHz | 8192 | MULTI BANK PAGE BURST | DDR3L DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 8 | 12 mA | 219 µA | 1.45 V | 1.283 V | CMOS | R-PBGA-B96 | Not Qualified | e1 | NOT SPECIFIED | NOT SPECIFIED | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | 2190 | 2024-11-15 23:06:24 | 8 X 14 MM, LEAD FREE, FBGA-96 | compliant | EAR99 | 8542.32.00.32 | 12 weeks | 5.07 | ||||||||||||
对比 | MT48LC8M16A2P-6A:L | Micron Technology Inc | 查询价格 | Yes | Active | 134.2177 Mbit | 16 | 8MX16 | 3.3 V | 5.4 ns | 167 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 2.5 mA | 100 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | Not Qualified | e3 | 70 °C | 260 | 30 | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2190 | 2024-11-15 23:16:23 | TSOP2, TSOP54,.46,32 | compliant | EAR99 | 8542.32.00.02 | 14 weeks 1 day | 4 | TSOP2 | 54 | ||||||||
对比 | AS4C32M16D2A-25BCN | Alliance Memory Inc | 查询价格 | Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 400 ps | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | 3 | 85 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | 1689 | 2024-11-15 23:10:44 | FBGA-84 | compliant | Taiwan | EAR99 | 8542.32.00.28 | 16 weeks | 4 | ||||||||||||||||||||||
对比 | IS43R16320E-5TL-TR | Integrated Silicon Solution Inc | 查询价格 | Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 2.5 V | 700 ps | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | YES | 2.7 V | 2.3 V | CMOS | COMMERCIAL | R-PDSO-G66 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2070 | 2024-06-03 16:39:07 | TSOP2, | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.28 | 20 weeks | 4.25 | |||||||||||||||||||||
对比 | IS42S16160J-7TL | Integrated Silicon Solution Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2070 | 2024-11-15 23:06:33 | TSOP2, | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | 10 weeks | 4 | |||||||||||||||||||||
对比 | IS42S16160J-6BLI | Integrated Silicon Solution Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PBGA-B54 | e1 | 85 °C | -40 °C | 260 | 54 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | 2070 | 2024-11-15 23:06:40 | TFBGA, | compliant | Mainland China, Taiwan | EAR99 | 8542.32.00.24 | 10 weeks | 4 | |||||||||||||||||||
对比 | MT46V64M8P-5B:J | Micron Technology Inc | 查询价格 | Yes | Active | 536.8709 Mbit | 8 | 64MX8 | 2.6 V | 700 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR1 DRAM | AUTO/SELF REFRESH | COMMON | 2,4,8 | 1 | 1 | 64000000 | 536.8709 M | SYNCHRONOUS | 3-STATE | YES | 2,4,8 | 5 mA | 230 µA | 2.7 V | 2.5 V | CMOS | COMMERCIAL | R-PDSO-G66 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 66 | PLASTIC/EPOXY | TSOP2 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 2190 | 2024-11-15 23:17:56 | TSSOP, TSSOP66,.46 | compliant | EAR99 | 8542.32.00.28 | 6 weeks 1 day | 4.25 | TSOP | 66 | |||||||
对比 | AS4C16M16SA-6TCN | Alliance Memory Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5 ns | 166 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 1,2,4,8,FP | 25 mA | 60 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 260 | 40 | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:10:59 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 8 weeks | 4 | ||||||||||
对比 | AS4C4M16SA-6TCN | Alliance Memory Inc | 查询价格 | Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:10:37 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 8 weeks | 4 | ||||||||||||||||||||
对比 | AS4C16M16SA-6TIN | Alliance Memory Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5 ns | 166 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 1,2,4,8,FP | 25 mA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G54 | e3 | 3 | 85 °C | -40 °C | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:06:55 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 8 weeks | 4 | |||||||||||
对比 | AS4C8M16SA-6TIN | Alliance Memory Inc | 查询价格 | Yes | Active | 134.2177 Mbit | 16 | 8MX16 | 3.3 V | 5 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G54 | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:10:23 | 0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.02 | 6 weeks | 4 | |||||||||||||||||
对比 | AS4C16M16SA-7TCN | Alliance Memory Inc | 查询价格 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 3.3 V | 5.4 ns | 143 MHz | 8192 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | YES | 1,2,4,8,FP | 20 mA | 3 V | 55 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | 1689 | 2024-11-15 23:06:55 | TSOP2-54 | compliant | Taiwan | EAR99 | 8542.32.00.24 | 8 weeks | 4 | |||||||||||
对比 | MT40A512M16TB-062E:R | Micron Technology Inc | 查询价格 | Yes | Active | 8.5899 Gbit | 16 | 512MX16 | 1.2 V | 1.6 GHz | 8192 | MULTI BANK PAGE BURST | DDR4 DRAM | COMMON | 8 | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 8 | 1.26 V | 1.14 V | CMOS | R-PBGA-B96 | 95 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 13 mm | 7.5 mm | 2190 | 2024-11-15 23:17:07 | compliant | 13 weeks 3 days | 5.07 |